Semiconductor device manufactured with a double shallow...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE29200, C257SE29201, C257SE21545, C257SE21549, C438S248000, C438S259000, C438S270000, C438S391000

Reexamination Certificate

active

07608878

ABSTRACT:
A method for manufacturing a semiconductor device includes forming a device isolation film by a double Shallow Trench Isolation (STI) process, forming a first active region having a negative slope and a second active region having a positive slope. Additionally, the method includes applying a recess region and a bulb-type recess region to the above-extended active region so as to prevent generation of horns in the active regions. This structure results in improvement in effective channel length and area.

REFERENCES:
patent: 6476444 (2002-11-01), Min
patent: 2005/0001252 (2005-01-01), Kim et al.
patent: 2005/0035427 (2005-02-01), Park et al.
patent: 2005/0285204 (2005-12-01), Kim et al.
patent: 2006/0001107 (2006-01-01), Kim et al.
patent: 1020020075008 (2002-10-01), None
patent: 1020020091916 (2002-12-01), None
patent: 1020050018187 (2005-02-01), None
patent: 1020060072962 (2006-06-01), None
patent: 1020060077543 (2006-07-01), None
patent: 1020060102878 (2006-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device manufactured with a double shallow... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device manufactured with a double shallow..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device manufactured with a double shallow... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4141542

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.