Semiconductor device, its manufacturing method, and dicing adhes

Details Semiconductor device, its manufacturing method, and dicing adhes Semiconductor device, its manufacturing method, and dicing adhes

1997-04-07

1999-09-28

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438464, 438460, 438928, 438976, H01L 2144, H01L 2148, H01L 2150

Patent

active

059602600

ABSTRACT:
Our semiconductor device is an IC chip 10 whose back surface is affixed to a mounting section 81 by means of a thermoplastic adhesive (for example, thermoplastic polyimide) 84. Package cracks are eliminated or markedly reduced and the problems with productivity for mounting curing and mounting alleviated. Even when a padless special lead frame or one with a small die pad is used, package cracks are eliminated or markedly reduced, and the lead frame can be mounted easily and with good reliability on top of the lead frame.

REFERENCES:
patent: 4664739 (1987-05-01), Aurichio
patent: 4793883 (1988-12-01), Sheyon et al.
patent: 5194934 (1993-03-01), Yamazaki et al.
patent: 5237205 (1993-08-01), Newman
patent: 5444301 (1995-08-01), Song et al.
patent: 5504374 (1996-04-01), Oliver et al.

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