Semiconductor device, its fabrication method and molding apparat

Details Semiconductor device, its fabrication method and molding apparat Semiconductor device, its fabrication method and molding apparat

1991-04-26

1993-04-06

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437207, 437215, 257668, 257697, H01L 2156, H01L 2160

Patent

active

052003663

ABSTRACT:
In a resin mold semiconductor device in which a chip is mounted to a substrate and one of its main planes is molded by a resin member by pressure molding, and in a molding apparatus therefor, a gate of a mold is formed in such a manner as to extend towards a radial center of wires inside a cavity so that the resin injected under pressure from a gate of the molding apparatus into the cavity flows in a radial direction along the wires and air vents are opened at the remotest positions of the cavity from the gate. Accordingly, there can be obtained a semiconductor device in which a gate trace is positioned on the upper surface of the resin member and on a vertical line passing through the radial center of leads formed radially on the substrate.

REFERENCES:
patent: 5008213 (1991-04-01), Kolesar, Jr.
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5064706 (1991-11-01), Ueda et al.
Nikkei Electronics Micro-Devices No. 2, published by Nikkei McGraw-Hill, Jun. 11, 1984, pp. 160-168.

Affiliated with

Also associated with

Rating

Semiconductor device, its fabrication method and molding apparat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, its fabrication method and molding apparat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device, its fabrication method and molding apparat will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-536425