Semiconductor device including pad portion for testing

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

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Details

257690, 257738, 257778, H01L 2358

Patent

active

057675287

ABSTRACT:
A semiconductor device includes a semiconductor element; a wiring board including a base film on which a plurality of leads are provided; projecting electrodes, provided in an array, projecting from a lower surface of the wiring board; a plurality of leads, each of which has an inner lead portion connected to the semiconductor element and an outer lead portion connected to the projecting electrodes; a mounting hole provided in the base film for mounting the semiconductor element; and a supporting member supporting the wiring board and having a cavity for accommodating the semiconductor element in a position corresponding to the mounting hole. A pad portion for measurement is provided at a position spaced from the outer lead portion.

REFERENCES:
patent: 5250841 (1993-10-01), Sloan et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5334858 (1994-08-01), Wada
patent: 5394009 (1995-02-01), Loo
patent: 5409865 (1995-04-01), Karnezos
patent: 5619070 (1997-04-01), Kozono

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