Semiconductor device including molded IC fixed to casing

Details Semiconductor device including molded IC fixed to casing Semiconductor device including molded IC fixed to casing

1997-12-01

2000-03-07

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257787, 257790, H01L 2348

Patent

active

060344210

ABSTRACT:
A molded IC having external terminals are fixed to a casing. The casing is provided with terminals by insert molding. Then, the external terminals of the molded IC are respectively fixed to the terminals fixed to the casing. In this case, a pitch L.sub.1 of the external terminals of the molded IC and a pitch L.sub.2 of the terminals fixed to the casing are chosen so that a difference between a product of the pitch L.sub.1 and a thermal expansion coefficient of resin for the molded IC and a product of the pitch L.sub.2 and a thermal expansion coefficient of resin for the casing becomes as small as possible. As a result, fixed portions between the external terminals of the molded IC and the terminals fixed to the casing can be prevented from being subject to excessive stress, even when the molded IC and the casing are thermally expanded.

REFERENCES:
patent: 5793118 (1998-08-01), Nakajima

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