Semiconductor device including inclined cut surface and...

Details Semiconductor device including inclined cut surface and... Semiconductor device including inclined cut surface and...

2007-09-04

2007-09-04

Toledo, Fernando L. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C257S678000, C257S692000

Reexamination Certificate

active

10892483

ABSTRACT:
A semiconductor device comprises a semiconductor element and electrodes electrically connected to the semiconductor element, the semiconductor element and the electrodes being sealed by a sealing agent having an insulating property, the electrodes being exposed around a mounting surface that is joined via a joining agent to an external mounting circuit board, wherein the electrodes are shaped so that the joining agent is visually identifiable from side surfaces surrounding the mounting surface when the mounting surface is joined via the joining agent to the mounting circuit board.

REFERENCES:
patent: 6294439 (2001-09-01), Sasaki et al.
patent: 6400006 (2002-06-01), Neu et al.
patent: 6624505 (2003-09-01), Badehi
patent: 6777767 (2004-08-01), Badehi
patent: 6972480 (2005-12-01), Zilber et al.
patent: 2001/0021543 (2001-09-01), Neu et al.
patent: 2003/0080398 (2003-05-01), Badehi
patent: 2003-031753 (2003-01-01), None

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