Semiconductor device including conductive element

Details Semiconductor device including conductive element Semiconductor device including conductive element

2009-02-19

2011-12-06

Andujar, Leonardo (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23069, C257SE21576

Reexamination Certificate

active

08072071

ABSTRACT:
A semiconductor device includes a chip comprising a contact element, a structured dielectric layer over the chip, and a conductive element coupled to the contact element. The conductive element comprises a first portion embedded in the structured dielectric layer, a second portion at least partially spaced apart from the first portion and embedded in the structured dielectric layer, and a third portion contacting a top of the structured dielectric layer and extending at least vertically over the first portion and the second portion.

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“An Embedded Device Technology Based on a Molded Reconfigured Wafer”, M. Brunnbauer, et al., IEEE, 2006 (5 pgs.).

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