Semiconductor device including an electrode

Details Semiconductor device including an electrode Semiconductor device including an electrode

1992-08-13

1994-03-29

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257766, 257771, 257784, H01L 2348, H01L 2944

Patent

active

052987930

ABSTRACT:
There is disclosed a semiconductor device having an electrode for wire bonding, comprising a first aluminum layer, a nickel-aluminum alloy layer, and a second aluminum layer. The electrode is suitable for bonding with copper wire, since the electrode withstands a wide range of bonding conditions--mechanical pressure, ultrasonic wave power and such, and permits a reliable electrical connection to be maintained.

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