Semiconductor device including a semiconductor element mounted o

Details Semiconductor device including a semiconductor element mounted o Semiconductor device including a semiconductor element mounted o

1995-06-30

1996-07-16

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257773, 257777, 257778, 257784, H01L 2349, H01L 2352

Patent

active

055369731

ABSTRACT:
In a semiconductor device and a method for manufacturing the same according to the present invention, a bonding wire is bonded to an electrode pad of a semiconductor element by ball bonding. The bonding wire is cut to have a predetermined length, and compressed and crushed into a bump. By doing so, a wire bump electrode is formed on each electrode pad of the semiconductor element. The wire bump electrodes formed on the electrode pads are then bonded to the respective substrate electrodes on a mounting substrate by melting a low-melting metal. As a result, a flip chip bonding structure wherein the semiconductor element and mounting substrate are bonded to each other by the wire bump electrodes, is obtained. Even in a semiconductor device wherein a semiconductor element is bonded to a resin type mounting substrate whose thermal expansion coefficient greatly differs from that of the semiconductor element, a flip chip bonding structure, which is strong in a heat cycle test and has high reliability, can be achieved.

REFERENCES:
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5189507 (1993-02-01), Carlomagno et al.

Affiliated with

Also associated with

Rating

Semiconductor device including a semiconductor element mounted o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device including a semiconductor element mounted o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device including a semiconductor element mounted o will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1786519