Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2008-05-13
2008-05-13
Warren, Matthew E. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S671000, C257S676000, C257SE23055, C257SE23060, C257SE23065, C257SE23066
Reexamination Certificate
active
07372130
ABSTRACT:
A semiconductor device includes: an insulating tape having a device hole and a plurality of holes; a plurality of leads formed on one surface of the tape and extending at one end into the device hole and at the other end into the holes; a semiconductor chip having a plurality of electrodes on a main surface thereof, being connected with the leads extending into the device hole; an encapsulant formed of an insulating resin, the leads and a predetermined portion of the tape; bump electrodes provided on one surface of the leads; slits provided in the tape between the encapsulant and the bump electrodes and extending along a column of the bump electrodes; and a warp prevention reinforcement made of an insulating film and formed over the tape; wherein the semiconductor chip and the bump electrodes are connected to one and the same surface side of the leads.
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Hatasawa Akihiko
Kagaya Yutaka
Kikuchi Koya
Kusanagi Keiyo
Shimada Noriou
Antonelli, Terry Stout & Kraus, LLP.
Elpida Memory Inc.
Warren Matthew E.
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