Semiconductor device including a plurality of input buffer circu

Details Semiconductor device including a plurality of input buffer circu Semiconductor device including a plurality of input buffer circu

1997-11-26

1998-09-01

Arroyo, Teresa Maria

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257784, 257691, 257692, H01L 2348, H01L 2352, H01L 2940

Patent

active

058014519

ABSTRACT:
A control signal applied to a lead terminal is transmitted to metal wires and bonding pads. The control signal arriving at the bonding pads are provided at high speed from the lead terminal to the input nodes of input buffer circuits via interconnection layers with almost no difference in the signal transmission time delay. The input buffer circuits can be disposed in close proximity to a desired circuit controlled by the same control signal and also in close proximity to any of the bonding pads. The length of the interconnection layers for connecting an input node of an input buffer circuit with a corresponding bonding pad can be reduced, so that the difference in the signal transmission time delay can be neglected. Thus, a high speed semiconductor device is provided that can have the signal delay difference of a control signal applied to the input buffers reduced.

REFERENCES:
patent: 4974053 (1990-11-01), Kinoshita et al.
patent: 5229846 (1993-07-01), Kozuka
patent: 5321654 (1994-06-01), Miyamoto et al.
patent: 5391918 (1995-02-01), Koyanagi et al.
patent: 5473198 (1995-12-01), Hagiya et al.

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