Semiconductor device in which occurrence of slips is suppressed

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S531000, C257S368000, C257S371000, C438S199000, C438S223000

Reexamination Certificate

active

06885069

ABSTRACT:
A substrate contains dissolved oxygen at a concentration of not more than 8×1017atoms/cm3and an impurity which is used as an acceptor or donor at a concentration of not more than 1×1015atoms/cm3. In the substrate, an oxygen precipitation layer used to suppress occurrence of a slip starting from the rear surface of the substrate is formed. On the substrate, a silicon layer in which circuit elements are formed and which contains dissolved oxygen with at concentration of not more than 8×1017atoms/cm3and an impurity which is used as an acceptor or donor at a concentration of not more than 1×1015atoms/cm3is formed.

REFERENCES:
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patent: 6335233 (2002-01-01), Cho et al.
patent: 6676748 (2004-01-01), Himi et al.
patent: 10303138 (1998-11-01), None
J.N. Burghartz, et al., “Monolithic Spiral Inductors Fabricated Using a VLSI Cu-Damascene Interconnect Technology and Low-Loss Substrates,” International Electron Device Meeting Digest, 1996, pp. 99-102.
C. Patrick Yue, et al., “A Physical Model for Planar Spiral Inductors on Silicon,” International Electron Device Meeting Digest, 1996, pp. 155-158.
S. Meada, et al., “Impact of0.82 μmSOI CMOS Technology using Hybrid Trench Isolation with High Resistivity Substrate on Embedded RF/Analog Applications,” VLSI Technology Digest, 2000, pp. 154-155.

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