Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2005-03-22
2005-03-22
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S691000, C257S735000, C257S737000, C257S778000
Reexamination Certificate
active
06870275
ABSTRACT:
A semiconductor device includes a semiconductor chip with a functional surface, a substrate opposing the functional surface of the semiconductor chip at a space formed between the substrate and the functional surface, a power supplying device electrically connected to a part of the functional surface of the semiconductor chip and separated by a slight gap from the substrate, a fixing member that fixes the semiconductor chip to the substrate, and a sealing member that seals the space formed between the substrate and the functional surface of the semiconductor chip other than a space formed between the substrate and the functional surface of the semiconductor chip that are fixed to each other through the fixing member and other than the gap formed between the power supplying device and the substrate. The sealing member has greater elasticity than the fixing member.
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Flynn Nathan J.
Mandala Jr. Victor A.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Ricoh & Company, Ltd.
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