Semiconductor device image inspection utilizing image subtractio

Details Semiconductor device image inspection utilizing image subtractio Semiconductor device image inspection utilizing image subtractio

1996-03-21

1999-09-07

Boudreau, Leo H.

Image analysis

Applications

Manufacturing or product inspection

G06T 550

Patent

active

059499010

ABSTRACT:
Machine vision methods for inspection of semiconductor die surfaces include the steps of generating a first image of the die surface, generating a second image of the die surface and any defect thereon, and subtracting the second image from the first image. The methods are characterized in that the second image is generated such that subtraction of it from the first image emphasizes the defect with respect to the die surface.

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