Semiconductor device having voltage distribution ring(s) and met

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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Details

257666, 437209, 437217, 437220, H01L 2348, H01L 2160

Patent

active

053430743

ABSTRACT:
A semiconductor device (10) includes a voltage distribution ring (20) attached to a plurality of leads (16). The ring is made up of an insulating layer (24), preferably polyimide, and a metal layer (22), preferably gold-plated copper foil. The ring may also include intervening adhesive layers (not illustrated). The ring surrounds a semiconductor die (12) and is electrically coupled to bond pads (14) of the die by wire bond (18). In various embodiment of the invention, the ring may be segmented to distribute two different voltages, such as power and ground; the ring may include slots to expose underlying portions of the leads; and the ring may be attached to either the top surface or bottom surface of the leads.

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