Semiconductor device having test element groups

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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10428130

ABSTRACT:
A plurality of chip regions are defined over a surface of a semiconductor substrate and separated from one another by a scribe region. A plurality of main pads are disposed in the chip regions and a test element group is disposed at the scribe region. The test element group is electrically connected to the main pads through interconnections.

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patent: 1020020082757 (2002-10-01), None
patent: WO 97/13226 (1997-04-01), None

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