Semiconductor device having tapered conductive lines and fabrica

Details Semiconductor device having tapered conductive lines and fabrica Semiconductor device having tapered conductive lines and fabrica

1997-06-25

2000-01-04

Dutton, Brian

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438640, 438623, 438673, 438701, H01L 21283

Patent

active

060109572

ABSTRACT:
A semiconductor device and fabrication process in which tapered conductive lines are formed. Consistent with one embodiment of the invention, a semiconductor device is formed by forming at least one conductive structure over a substrate and forming an insulating layer over the conductive structure. The insulating layer is provided with one or more tapered grooves separated from the conductive structure by a portion of the insulating layer. In each tapered groove a conductive line is formed. The conductive lines may, for example, be metal lines. The conductive structures may, for example, be active regions of a transistor or a previously formed conductive line. A portion of the insulating layer between the conductive layers may be a low dielectric material.

REFERENCES:
patent: 4363830 (1982-12-01), Hsu et al.
patent: 4906592 (1990-03-01), Merenda et al.
patent: 5338955 (1994-08-01), Tamura et al.
patent: 5395801 (1995-03-01), Doan et al.
patent: 5424247 (1995-06-01), Sato
patent: 5445996 (1995-08-01), Kodera et al.
patent: 5451551 (1995-09-01), Krishnan et al.
patent: 5565384 (1996-10-01), Havemann
patent: 5635428 (1997-06-01), Martin et al.
patent: 5651857 (1997-07-01), Cronin et al.
patent: 5665643 (1997-09-01), Shin
patent: 5728608 (1998-03-01), Su et al.
patent: 5728628 (1998-03-01), Havemann
patent: 5783488 (1998-07-01), Bothra et al.
S. Wolf, "Silicon Processing for the VLSI Era vol. 1--Process Technology", p. 273, 1986.
S. Wolf, "Silicon Processing for the VLSI Era vol.2--Process Integration," pp. 188-217, 240-260, and 334-337, copyright 1990.

Affiliated with

Also associated with

Rating

Semiconductor device having tapered conductive lines and fabrica does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having tapered conductive lines and fabrica, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having tapered conductive lines and fabrica will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1072356