Semiconductor device having tab tape

Details Semiconductor device having tab tape Semiconductor device having tab tape

1993-06-04

1994-11-15

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

257712, 257737, 257787, 257692, 257696, H01L 2302

Patent

active

053651073

ABSTRACT:
A semiconductor device has a semiconductor element mounted on inner leads of a TAB tape and first and second heat radiator elements having respective first and second peripheral flanges which cooperatively engage and thereby support the TAB tape in a sandwich manner therebetween, at least one heat radiator member having a central portion protruding toward and providing a support for the semiconductor element. A sealing resin fills the space between the heat radiator members and thereby integrally interconnects and hermetically seals interior surfaces of the leads of the TAB tape. A central portion of at least one of the heat radiator members protrudes toward and provides a support for the semiconductor element.

REFERENCES:
patent: 4809053 (1989-02-01), Kuraishi
patent: 5157478 (1992-10-01), Ueda et al.

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