Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2006-03-08
2009-08-25
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257S706000, C257S707000, C257SE23051, C257SE23101, C257SE23102
Reexamination Certificate
active
07579675
ABSTRACT:
A semiconductor device having surface-mountable external contact areas and a method for producing the same is disclosed. The surface-mountable external contacts are arranged as flat external contacts on the underside of the semiconductor device. In one embodiment, the semiconductor chip of the semiconductor device has a source contact area and a gate contact area on its top side and a drain contact area on its rear side. The source contact area is fixed on a cutout of a heat sink, which is connected to a source external contact, a top side of the heat sink partly forming the top side of the semiconductor device. The drain contact area is electrically connected to a drain external contact and the gate contact area is electrically connected via a connecting element to a gate external contact on the underside of the semiconductor device. Consequently, the semiconductor device as areas which dissipate the heat loss both on the underside and on the top side.
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Hosseini Khalil
Koenigsberger Alexander
Clark Jasmine J
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
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