Semiconductor device having spherical terminals attached to the

Details Semiconductor device having spherical terminals attached to the Semiconductor device having spherical terminals attached to the

1993-04-29

1994-03-08

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257666, 257676, 257697, 257698, 257738, 257774, 257787, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

052930726

ABSTRACT:
A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, and of a substantially identical diameter.

REFERENCES:
patent: 3959874 (1976-06-01), Coucoulas
patent: 4994902 (1991-02-01), Okahashi et al.
IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, E. Stephans, "Pinless Module Connector," p. 3872.
Electronics, vol. 58, No. 37, Sep. 1985, New York, "Solder Columns Secure Chip Carriers to Epoxy," pp. 20-21.

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