Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-12-05
2006-12-05
Chambliss, Alonzo (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S772000, C257S779000, C257S780000, C438S108000, C438S613000
Reexamination Certificate
active
07145236
ABSTRACT:
A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.
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Miura Kazuma
Nakatsuka Tetsuya
Serizawa Koji
Shimokawa Hanae
Soga Tasao
Chambliss Alonzo
Renesas Technology Corp.
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