Semiconductor device having shallow trenches and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S330000, C257S333000

Reexamination Certificate

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10924808

ABSTRACT:
The capacitance between the gate electrode film and the drain layer of semiconductor device is reduced while keeping the resistance low, with the breakdown voltage of the gate insulating film also being maintained at a sufficient level. A trench10is formed with the bottom of the trench at a comparatively shallow position in an N-epitaxial layer18.The thickness of a bottom surface part16of a gate electrode film11is formed so as to be thicker than other parts of the gate electrode film11.Also, when a P type body layer19is formed, an interface between the P type body layer19and an N-epitaxial layer18is located at a deeper position than a bottom end of the gate electrode film11.

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