Semiconductor device having resin anti-bleed feature

Details Semiconductor device having resin anti-bleed feature Semiconductor device having resin anti-bleed feature

2007-02-27

2007-02-27

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S788000, C257S793000, C257S724000, C257SE23040, C257SE23180

Reexamination Certificate

active

10947695

ABSTRACT:
A device and a method for controlling resin bleed, the device comprising a substrate having a surface, wherein an interior region, a peripheral region, and an exterior region of the surface are generally defined. An adhesive generally resides on the surface of the substrate in the peripheral region thereof, wherein the adhesive comprises a plurality of components, such as a metal and a resin. A first barrier is formed on the surface of the substrate generally between the adhesive and the exterior region, wherein the first barrier generally prevents one or more of the plurality of components of the adhesive from bleeding onto the exterior region of the surface of the substrate.

REFERENCES:
patent: 6291264 (2001-09-01), Tang et al.

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