Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1998-06-26
2000-08-08
Williams, Alexander O.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257737, 257738, 257692, 257693, 257 84, 257 81, 257116, 257100, 257 98, 257432, 257434, 385 92, 385 94, 385 65, H01L 2314, H01L 3300, G02B 642, G02B 630
Patent
active
061005959
ABSTRACT:
A semiconductor device includes a chip forming an integrated circuit; a connection substrate; an internal coupling mechanism; and at least one optical communication system. The connection substrate comprises an external coupling mechanism for electrically coupling to a device other than the chip. The internal coupling mechanism electrically couples the integrated circuit to the external coupling mechanism. The at least one optical communication system comprises two optoelectronic parts. The first optoelectronic part is either an emitter or a receiver which is integrated into the chip and constitutes one component of the integrated circuit. The second optoelectronic part is borne by the connection substrate and is able to be externally connected to the connection substrate. The second optoelectronic part faces the first optoelectronic part and is capable of exchanging light signals with the first optoelectronic part.
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Optical Module with MU Connector Interface Using Self-alignment Technique by Solder-bump Chip Bonding--1996 Electronic Components and Technology Conference-Hayashi et al, XP000646648 May 28, 1996.
Active Atmosphere Solder Self-alignment and Bonding of Optical Components--International Journal of Microcircuits and Electronic Packaging 16(1993)Second Quarter, No.2, Reston, VA US.
French Search Report.
Jaouen Herve
Marty Michel
Bongini Stephen
Galanthay Theodore E.
STMicroelectronics S.A.
Williams Alexander O.
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