Static information storage and retrieval – Read/write circuit – Testing
Reexamination Certificate
2000-04-18
2002-01-08
Nguyen, Viet Q. (Department: 2818)
Static information storage and retrieval
Read/write circuit
Testing
C714S025000, C714S042000, C714S718000, C714S721000
Reexamination Certificate
active
06337819
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device having an on-chip terminal with a voltage to be measured in a test.
2. Description of the Related Art
FIG. 5
 shows a step-down circuit 
10
 included in a semiconductor device.
This circuit is used for providing an internal power supply voltage VII, obtained by stepping down an external power supply voltage VCC supplied to an external terminal of the circuit, to circuit blocks in the semiconductor device. For example, VCC=5.0 V and VII=3.3 V. A current flows from VCC to an NMOS transistor 
11
, and the source of the NMOS transistor 
11
 is the internal power supply voltage VII. The VII is lower than the gate voltage VG of the NMOS transistor 
11
 by the threshold voltage Vth thereof. Therefore, the gate voltage VG is controlled by a voltage control circuit 
12
 so as to be constant independently of variations of the voltage VCC and temperature.
In the voltage control circuit 
12
, a reference voltage Vref produced in a reference voltage generation circuit 
14
 is provided to the gate of an NMOS transistor 
131
 in a differential amplification circuit 
13
. The reference voltage Vref is almost constant independently of variations of the voltage VCC and temperature. The drain voltage of the NMOS transistor 
131
 is provided to the gate of a PMOS transistor 
151
 in an output buffer circuit 
15
 as the output of the differential amplification circuit 
13
. The voltage of a node N
1
 connected to the drain of the PMOS transistor 
151
 is the output VG of the voltage control circuit 
12
. The voltage VG is lowered by an NMOS transistor 
152
 in the output buffer circuit 
15
 by its threshold voltage Vth and provided to the gate of an NMOS transistor 
132
 in the differential amplification circuit 
13
. Therefore, the gate voltage of the NMOS transistor 
132
 is equal to the voltage VII to be controlled.
In the above described configuration, when VII falls down and then VII<Vref, the gate voltage VG and the gate voltage of the NMOS transistor 
132
 fall as well. With the falls in the voltages, the gate voltage of the PMOS transistor 
151
 falls to decrease the internal resistance thereof, and the gate voltage VG together with the voltage VII rise. Contrary to this, when VII>Vref, the gate voltage of the PMOS transistor 
151
 rises to increase the internal resistance thereof, and the gate voltage VG together with the voltage VII fall. By such operation, the voltage VII follows the stabilized reference voltage Vref.
In order to measure the gate voltage VG prior to shipment of the semiconductor device, the node N
1
 is connected to a pad 
16
 formed on the semiconductor chip with the pad 
16
, the probe 
18
 connected through a cable 
19
 to a tester 
17
 is put into contact.
Since the voltage control circuit 
12
 is only required to control the gate voltage VG of the NMOS transistor 
11
, the current flowing through the output buffer circuit 
15
 can be small compared with the current flowing through the NMOS transistor 
11
 and thereby, low power consumption in the voltage control circuit 
12
 is realized by use of a larger resistance R
1
 of the output buffer circuit 
15
. On the other hand, although the internal resistance Rt of the tester 
17
 is comparatively large, the combined capacitance of the probe 
18
 and cable 
19
 is much larger than that of the node N
1
.
Hence, when the probe 
18
 of the tester 
17
 is put into contact with the pad 
16
, a change in the gate voltage VG cannot be detected correctly by the tester 
17
. If a circuit for diminishing an influence of the probe 
18
 and cable 
19
 of the tester 
17
 is incorporated in the step-down circuit 
10
, power consumption increases in normal operation by a user.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a semiconductor device, having an on-chip terminal with a voltage to be measured in a test, that makes it possible to more accurately measure the voltage of the terminal without increasing in power consumption in the normal use.
In the present invention, there is provided a semiconductor device comprising: an internal circuit having a node with a voltage to be measured in a test; an on-chip terminal; and a voltage follower circuit, having an input for receiving a voltage of the node, activated in response to activation of a test mode signal, for providing its output to the on-chip terminal.
With the present invention, the node voltage is indirectly measured through the voltage follower circuit and therefore, when the probe of a tester is put into contact with the on-chip terminal such as a pad, the influence of the capacitance of the probe is small, which in turn enables more accurate measurement of the node voltage of the internal circuit.
Further, since the voltage follower circuit is deactivated by deactivating the test mode signal in normal operation, increase in power consumption can be avoided even with the voltage follower circuit provided, otherwise a comparatively large current flows through the voltage follower circuit.
Other aspects, objects, and the advantages of the present invention will become apparent from the following detailed description taken in connection with the accompanying drawings.
REFERENCES:
patent: 6212089 (2001-04-01), Kajigaya et al.
patent: 356079267 (1981-06-01), None
patent: 402306179 (1990-12-01), None
patent: 403076407 (1991-04-01), None
patent: 410038982 (1998-02-01), None
patent: 411211787 (1999-08-01), None
patent: 0200004859 (2000-02-01), None
Arent Fox Kintner & Plotkin & Kahn, PLLC
Fujitsu Limited
Nguyen Viet Q.
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