Semiconductor device having multiple substrates

Details Semiconductor device having multiple substrates Semiconductor device having multiple substrates

2005-11-08

2008-12-16

Dickey, Thomas L (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C073S514010

Reexamination Certificate

active

07466000

ABSTRACT:
A semiconductor device includes a first substrate including first, second and third layers; a second substrate; and a loop bump. The first and second substrates provides an electric device and physical quantity sensor. The first layer is a shield for protecting the electric device and physical quantity sensor. The physical quantity sensor includes a movable portion surrounded by a first loop layer of the third layer. The loop bump is disposed between the first and second substrates and surrounds the movable portion, and is electrically coupled with the first loop layer so that the loop bump, first loop layer, first layer and second substrate shield the electric device and physical quantity sensor. The first substrate includes inner and outer pads which are electrically coupled through a wire layer which is electrically insulated from the loop bump, so that a signal from the movable portion is output to and external circuit.

REFERENCES:
patent: 6153917 (2000-11-01), Matsunaga et al.
patent: 6167761 (2001-01-01), Hanzawa et al.
patent: 6316840 (2001-11-01), Otani
patent: 6518084 (2003-02-01), Seitz et al.
patent: 2003/0047804 (2003-03-01), Otani
patent: A-2002-50771 (2002-02-01), None

Affiliated with

Also associated with

Rating

Semiconductor device having multiple substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having multiple substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having multiple substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4031768