Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent
1997-08-18
1999-06-29
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
257678, 257673, 257784, 257666, 257671, 257674, 257782, 257783, 257676, H01L 23495, H01L 2348
Patent
active
059172355
ABSTRACT:
A semiconductor device with a LOC structure having a semiconductor device lead frame, TAB leads, and an insulating TAB tape, wherein the semiconductor device lead frame has a plurality of leads and is formed by fixing a semiconductor element on one surface side of the leads through insulating tapes. The leads are arranged to correspond to electrodes of the semiconductor element, wherein the TAB leads electrically connect the leads of the semiconductor device lead frame and the electrodes on the semiconductor element, and wherein the insulating TAB tape has electrical insulating characteristics and is fixed on the other surface side of the leads of the semiconductor device lead frame to surround a group electrodes of the semiconductor element, the insulating TAB tape serving to hold the TAB leads to be isolated from each other.
REFERENCES:
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5293068 (1994-03-01), Kohno et al.
patent: 5587607 (1996-12-01), Yasuda et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5710457 (1998-01-01), Uno
patent: 5780923 (1998-07-01), Courtenay
NEC Corporation
Williams Alexander Oscar
LandOfFree
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