Semiconductor device having insulating substrate adhered to cond

Details Semiconductor device having insulating substrate adhered to cond Semiconductor device having insulating substrate adhered to cond

1990-01-03

1992-06-23

Hille, Rolf

Land vehicles: wheels and axles

Wheel

Compression wheel

357 80, 357 72, 357 70, 301387, 301388, H01L 2302

Patent

active

051247836

ABSTRACT:
A semiconductor device includes at least one semiconductor chip, an insulating substrate having a predetermined wiring pattern thereon and a conductive island which supports the insulating substrate and the semiconductor chip. The periphery of the insulating substrate is adhered to the conductive island by an insulating adhesive. The semiconductor chip is positioned in a hole formed in the insulating substrate and is adhered to the conductive island by a conductive adhesive.

REFERENCES:
patent: 3936866 (1976-02-01), Grossman et al.
patent: 4200880 (1980-04-01), Frey
patent: 4314270 (1982-02-01), Iwatani
patent: 4459166 (1984-07-01), Dietz et al.
patent: 4774635 (1988-09-01), Greenberg et al.
patent: 4984065 (1991-01-01), Sako

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