Active solid-state devices (e.g. – transistors – solid-state diode – Voltage variable capacitance device – Plural diodes in same non-isolated structure – or device...
Reexamination Certificate
2005-03-15
2005-03-15
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Voltage variable capacitance device
Plural diodes in same non-isolated structure, or device...
C257S577000, C257S910000
Reexamination Certificate
active
06867478
ABSTRACT:
A semiconductor device manufacturing method is used for packaging a thin semiconductor chip in an economical manner. A semiconductor chip having one electrode terminal, a first member having a first conductor on its surface, and a second member having a second conductor on its surface are prepared. The first and second members are positioned such that the first and second conductors face each other, and the semiconductor chip is held between the members. In this arrangement, one of the first and second conductors is in electrical contact with the first electrode.
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Japanese patent application 08-316194.
Antonelli Terry Stout & Kraus LLP
Berezny Nema
Hitachi , Ltd.
Jr. Carl Whitehead
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