Semiconductor device having groups of pads which receive the sam

Details Semiconductor device having groups of pads which receive the sam Semiconductor device having groups of pads which receive the sam

1994-05-24

1995-01-31

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257786, H01L 2702

Patent

active

053861272

ABSTRACT:
A semiconductor device comprises a bonding pad serving as a power supply terminal and a plurality of bonding pads having the same function and serving as one of grouped terminals other than the power supply terminal.

REFERENCES:
patent: 4413271 (1983-11-01), Gontowski, Jr. et al.
patent: 4833620 (1989-05-01), Takahashi
patent: 4884122 (1989-11-01), Eichelberger et al.
patent: 4974053 (1990-11-01), Kinoshita
patent: 5008727 (1991-04-01), Katsura et al.
patent: 5083181 (1992-01-01), Yoshida
Mavor, et al., "Introduction to MOS LSI Design", 1983, Addison-Wesley, London, pp. 8-13, Plates 2-4.
"Protecting Si Wafers Against Damage During Testing", IBM Technical Disclosure Bulletin, vol. 32, No. 4A, Sep. 1989, p. 121.
Pearson, "Masterplan (A Simplified Method of Design)", Proceedings of the 1st International Conference on Semi-Custom ICs, Nov, 1981, pp. 201-213.

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