Semiconductor device having dual electrical contact sites

Details Semiconductor device having dual electrical contact sites Semiconductor device having dual electrical contact sites

1991-02-06

1992-10-20

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 357 70, 357 72, 174 524, 361404, 361405, 361410, 439 61, 439 68, 439 70, H01L 2302, H01L 2312

Patent

active

051574802

ABSTRACT:
A semiconductor device having both bottom-side contacts and peripheral contacts provides surface mounting options. In one form, a semiconductor device die is positioned at a die receiving area of a leadframe. The leadframe also has a plurality of leads, each lead having a first and a second contact portion which are separated by an intermediate portion. A package body encapsulates the semiconductor device die and intermediate portions of the plurality of leads. The first contact portions of the leads are partially exposed on the bottom surface of the package body. The second contact portions extend from the package body along a portion of the package body perimeter. The first contact portions provide bottom-side contacts to the device, while the second contact portions provide peripheral contacts. The second contact portions are shaped into a desired lead configuration or are severed to establish a leadless device.

REFERENCES:
patent: 4089575 (1978-05-01), Grabbe
patent: 4540226 (1985-09-01), Thompson et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4595794 (1986-06-01), Wasserman
patent: 4647126 (1987-03-01), Sobota, Jr.
patent: 4873615 (1989-10-01), Grabbe
patent: 4969827 (1990-11-01), Hahs, Jr.
patent: 5006922 (1991-04-01), McShane et al.
patent: 5043794 (1991-08-01), Tai et al.

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