Semiconductor device having die pad locking to substantially red

Details Semiconductor device having die pad locking to substantially red Semiconductor device having die pad locking to substantially red

1993-04-02

1994-10-25

Thomas, Tom

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437220, H01L 2160

Patent

active

053589050

ABSTRACT:
A semiconductor device package (10) comprises plastic encapsulation (20) around a die pad (14) and a semiconductor chip (12). The semiconductor chip (12) is electrically interconnected to lead fingers (18) by conductive wires (16). The die pad (14) has at least one ear or tab (26) extending outward from die pad (14). In one embodiment of the invention, at least one hole (34) is formed through each ear or tab (26). In another embodiment of the invention, each ear or tab (26) is bent or curved away from the horizontal plane of the die pad. In yet another embodiment of the invention, at least one hole (34) is formed through each ear or tab (26) and ear or tab (26) is bent or curved away from the horizontal plane of the die pad (14). Ear or tab (26), having at least one hole (34), bent or curved away from the horizontal plane of the die pad (14), or having at least one hole (34) and bent or curved away from the horizontal plane of the die pad (14) helps prevent cracks from occurring in the plastic encapsulation (20) due to differences in the thermal expansion rates of the die pad (14) and the plastic encapsulation (20).

REFERENCES:
patent: 3762039 (1973-10-01), Douglass et al.
patent: 3902189 (1975-08-01), Simpson
patent: 4177480 (1979-12-01), Hiatzmann et al.
patent: 4258381 (1981-03-01), Inaba
patent: 4298883 (1981-01-01), Komatsu et al.
patent: 4761518 (1988-08-01), Butt et al.
patent: 5096853 (1992-03-01), Yasunaga et al.
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5202288 (1993-04-01), Doering et al.

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