Semiconductor device having die attachment and die pad for...

Details Semiconductor device having die attachment and die pad for... Semiconductor device having die attachment and die pad for...

2007-07-03

2007-07-03

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S783000, C257SE23040

Reexamination Certificate

active

11440068

ABSTRACT:
A semiconductor device comprises a substrate, a ferroelectric capacitor which includes a ferroelectric film on the substrate, and a stress application layer which applies tensile or compressive stress to the ferroelectric film of the ferroelectric capacitor by applying stress to the substrate.

REFERENCES:
patent: 6141385 (2000-10-01), Yamaji
patent: 6348368 (2002-02-01), Yamazaki et al.
patent: 6432767 (2002-08-01), Torii et al.
patent: 6583512 (2003-06-01), Nakaoka et al.

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