Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2006-03-21
2006-03-21
Zarabian, Amir (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S684000, C257S787000
Reexamination Certificate
active
07015593
ABSTRACT:
There is provided a semiconductor device in which substantially no deformation of a bonded wire occurs, and a method for producing the semiconductor device. A wiring pattern of a wiring substrate and an electrode of an IC chip are connected by a wire. A contact prevention resin whose height is higher than the highest position of the bonded wire, is adhered to the approximate center of the surface of the IC chip. If the wiring substrate warps due to heat from the lower metallic mold, an inner surface of an upper metallic mold placed on the wiring substrate abuts against the contact prevention resin, and decrease warpage of the wiring substrate. Accordingly, the wire is kept from contacting the inner surface of the upper metallic mold. Thereafter, the IC chips, the wires, and the like are sealed by injecting a mold resin into the molds.
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Perkins Pamela E
Rabin & Berdo PC
Zarabian Amir
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