Semiconductor device having conductive adhesive layer and...

Details Semiconductor device having conductive adhesive layer and... Semiconductor device having conductive adhesive layer and...

2007-06-01

2010-06-08

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S737000, C257S778000, C257SE23021

Reexamination Certificate

active

07732934

ABSTRACT:
In a semiconductor device, a semiconductor substrate may include a plurality of first conductive pads. An insulating isolation layer may be on the semiconductor substrate so as to separate the first conductive pads. A package substrate may include a plurality of second conductive pads. A conductive adhesive layer may connect the first conductive pads and the second conductive pads.

REFERENCES:
patent: 5839188 (1998-11-01), Pommer
patent: 5874782 (1999-02-01), Palagonia
patent: 7135780 (2006-11-01), Jiang
patent: 7615864 (2009-11-01), Ito
patent: 2001/0023993 (2001-09-01), Kawashima
patent: 2002/0074641 (2002-06-01), Towle et al.
patent: 2005/0133914 (2005-06-01), Ito
patent: 2009/0039495 (2009-02-01), Yamashita et al.
patent: 10-2003-0004741 (2003-01-01), None
patent: 10-2003-0090481 (2003-11-01), None

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