Semiconductor device having complimentary bonding pads

Details Semiconductor device having complimentary bonding pads Semiconductor device having complimentary bonding pads

1994-01-06

1995-10-03

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257666, 257784, 257786, H01L 2348, H01L 2944, H01L 2952

Patent

active

054554608

ABSTRACT:
Among a plurality of pads disposed along four sides of a semiconductor chip, complementary pads connected to individual pads by conductors are provided for the pads situated near the corners of the semiconductor chip to allow different types of packages to be used with the single semiconductor chip.

REFERENCES:
patent: 4223337 (1980-09-01), Kojima et al.
patent: 4536786 (1985-08-01), Hayakawa et al.
patent: 4951098 (1990-08-01), Albergo et al.

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