Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1999-03-23
2000-12-12
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257780, 257786, 361760, 361777, H01L 2348
Patent
active
061603139
ABSTRACT:
A semiconductor device includes an insulating substrate; a semiconductor chip mounted on a front surface of the insulating substrate and provided with electrode pads; bonding pads provided on the front surface of the insulating substrate and electrically connected to the semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of the ball bumps, respectively, the electrode patterns being connected to the ball bumps through holes formed in the insulating substrate; and interconnection patterns electrically connecting the bonding pads and the electrode patterns. The bonding pads may be provided in a plurality of rows, each of the rows being provided between one of neighboring pairs of rows of the electrode patterns. Alternatively, the bonding pads may be provided in a staggered manner between one of neighboring pairs of rows of the electrode patterns.
REFERENCES:
patent: 5894410 (1999-04-01), Barrow
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 6031292 (2000-02-01), Murakami et al.
Higashiyama Toshihisa
Takashima Akira
Taniguchi Fumihiko
Chaudhuri Olik
Fujitsu Limited
Wille Douglas A.
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