Semiconductor device having an inductor formed on a region...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Reexamination Certificate

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C257S531000, C257S711000

Reexamination Certificate

active

06914331

ABSTRACT:
A semiconductor device has a semiconductor chip, a first insulating film and an inductor. The semiconductor chip includes an integrated circuit formed on the main surface of the chip and a plurality of pad electrodes formed on the main surface of the chip and electrically connected to the integrated circuit. The first insulating film of an insulating resin material is formed on the main surface of the semiconductor chip, covers the integrated circuit, and includes a plurality of contact holes provided on the respective pad electrodes. The inductor is formed on the inductor formation region of the first insulating film, and both terminals of the inductor are connected to the pad electrodes through the contact holes, respectively. The inductor formation region of the first insulating film is formed thicker than a portion of the first insulating film around the contact hole.

REFERENCES:
patent: 6492198 (2002-12-01), Hwang
patent: 6559528 (2003-05-01), Watase et al.
patent: 6852616 (2005-02-01), Sahara et al.
patent: 2001/0045616 (2001-11-01), Yoshitomi
patent: 2002/0017730 (2002-02-01), Tahara et al.
patent: 2002/0093082 (2002-07-01), Miyamoto et al.
patent: 2004/0023450 (2004-02-01), Katagiri et al.
patent: 2001-093932 (2001-04-01), None
patent: 2001-230369 (2001-08-01), None
patent: 2002-57292 (2002-02-01), None
patent: 2002-164468 (2002-06-01), None
patent: 2003-347472 (2003-12-01), None

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