Semiconductor device having an improved structure for storing a

Details Semiconductor device having an improved structure for storing a Semiconductor device having an improved structure for storing a

1996-04-18

1998-11-10

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

257778, 257 81, 257 82, 257432, 257787, H01L 2302, H01L 23495

Patent

active

058348352

ABSTRACT:
In the semiconductor of the present invention, the first pair of pad lines consisting of a plurality of pads are arranged on the bottom portion of the recess portion of the enclosure, the recess portion being made at the center portion of the enclosure by the counterboring process to have a predetermined depth. At approximately center of the recess portion, a suction opening is made so as to suck the potting material from outside. In the recess portion of the enclosure, the semiconductor chip is supported. The semiconductor chip has the second pair of pad lines arranged to oppose to the first pair of pad lines and electrically connected to the first pair of pad lines respectively. The potting material is poured into the recess portion so as to completely cover the semiconductor chip. At the same time, the potting material is sucked from the suction opening.

REFERENCES:
patent: 5357056 (1994-10-01), Nagano
patent: 5491362 (1996-02-01), Hamzehdoost et al.
patent: 5498906 (1996-03-01), Roane et al.
patent: 5523586 (1996-06-01), Sakurai
patent: 5710071 (1998-01-01), Beddingfield et al.
patent: 5721450 (1998-02-01), Miles

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