Semiconductor device having an improved packing density and high

Details Semiconductor device having an improved packing density and high Semiconductor device having an improved packing density and high

1994-09-16

1996-04-16

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257382, 257401, 257773, H01L 2976, H01L 2348, H01L 2352

Patent

active

055085644

ABSTRACT:
A semiconductor device is fabricated having contact holes formed in an interlayer insulator and on impurity diffusion regions positioned on either side of an isolator, The contact holes are arranged so as not to be disposed along a shortest line path across the isolator. This arrangement isolating interval and provides a structure which can realize higher packing density and improved reliability.

REFERENCES:
patent: 4603341 (1986-07-01), Bertin et al.
patent: 4839705 (1989-06-01), Tigelaar et al.
patent: 4994893 (1991-02-01), Ozaki et al.
patent: 5057899 (1991-10-01), Samata et al.
patent: 5061985 (1991-10-01), Meguro et al.
patent: 5072282 (1991-12-01), Takagi et al.
patent: 5083188 (1992-01-01), Yamagata
patent: 5103285 (1992-04-01), Furumura et al.

Affiliated with

Also associated with

Rating

Semiconductor device having an improved packing density and high does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having an improved packing density and high, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having an improved packing density and high will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-327365