Semiconductor device having an improved mounting structure

Details Semiconductor device having an improved mounting structure Semiconductor device having an improved mounting structure

2005-02-15

2005-02-15

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S780000, C257S738000, C257S778000, C257S782000, C257S784000, C257S787000, C257S701000

Reexamination Certificate

active

06856028

ABSTRACT:
In a semiconductor device, a semiconductor element is bonded to an insulating circuit board. A resin layer for bonding the semiconductor element to the insulating circuit board is extended so as to become greater in size than the semiconductor element. Further, the surroundings of the semiconductor element are sealed with resin. Reliability of mounting is improved by alleviating stress developing in a solder joint of the external electrodes of the circuit board.

REFERENCES:
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patent: 6048755 (2000-04-01), Jiang et al.
patent: 6049129 (2000-04-01), Yew et al.
patent: 6111306 (2000-08-01), Kawahara et al.
patent: 6144102 (2000-11-01), Amagai
patent: 6252298 (2001-06-01), Lee et al.
patent: 6429372 (2002-08-01), Taguchi et al.
patent: 6455354 (2002-09-01), Jiang et al.
patent: 1998-054344 (1998-09-01), None
patent: 328643 (1998-03-01), None

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