Semiconductor device having an improved connection arrangement b

Details Semiconductor device having an improved connection arrangement b Semiconductor device having an improved connection arrangement b

1995-12-11

1998-07-07

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257777, 257780, 257737, 257784, 438108, 438617, H01L 2349

Patent

active

057773912

ABSTRACT:
A semiconductor device comprising a semiconductor pellet mounted on a pellet mounting area of the main surface of a base substrate, in which first electrode pads arranged on the back of the base substrate are electrically connected to bonding pads arranged on the main surface of the semiconductor pellet. The base substrate is formed of a rigid substrate, and its first electrode pads are electrically connected to the second electrode pads arranged on its reverse side. The semiconductor pellet is mounted on the pellet mounting area of the main surface of the base substrate, with its main surface downward, and its bonding pads are connected electrically with the second electrode pads of the base substrate through bonding wires passing through slits formed in the base substrate.

REFERENCES:
patent: 5107328 (1992-04-01), Kinsman
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5442231 (1995-08-01), Miyamoto et al.
patent: 5519251 (1996-05-01), Sato et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5684330 (1997-11-01), Lee
Nikkei electronics 1994.2.28 (No. 602), pp. 111-117. (with translation).

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