Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reissue Patent
2005-07-15
2011-11-29
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257SE23004, C257SE23067, C257SE23069, C257S777000, C257S780000, C257S784000, C257S737000, C438S108000, C438S617000
Reissue Patent
active
RE042972
ABSTRACT:
A semiconductor device comprising a semiconductor pellet mounted on a pellet mounting area of the main surface of a base substrate, in which first electrode pads arranged on the back of the base substrate are electrically connected to bonding pads arranged on the main surface of the semiconductor pellet. The base substrate is formed of a rigid substrate, and its first electrode pads are electrically connected to the second electrode pads arranged on its reverse side. The semiconductor pellet is mounted on the pellet mounting area of the main surface of the base substrate, with its main surface downward, and its bonding pads are connected electrically with the second electrode pads of the base substrate through bonding wires passing through slits formed in the base substrate.
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Nikkei electronics Feb. 28, 1994 (No. 602), pp. 111-117, (with translation).
Nakamura Atsushi
Nishi Kunihiko
Antonelli, Terry Stout & Kraus, LLP.
Renesas Electronics Corporation
Williams Alexander O
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