Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor
Patent
1995-05-19
1996-01-09
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Junction field effect transistor
257774, 257766, H01L 2980, H01L 31112
Patent
active
054830923
ABSTRACT:
A semiconductor device including a conductive pad and a semiconductor chip soldered to the conductive pad, the semiconductor chip including a substrate having opposite front and rear surfaces, a first electrode disposed on the front surface, a dome-shaped via-hole having an opening at the rear surface of the substrate and a bottom in contact with the first electrode, and a second electrode covering the rear surface of the substrate and the internal surface of the via-hole. The semiconductor chip is soldered to the conductive pad so that a space is formed between the internal surface of the via-hole and the solder. The space has a distance d from the bottom of the via-hole in a direction perpendicular to the front surface of the substrate represented by ##EQU1## where x is the via-hole depth, y is rupture stress of the semi-conductor substrate, E.sub.1 is Young's modulus of a semi-conductor substrate, E.sub.2 is Young's modulus of the solder, .alpha..sub.1 is the linear thermal expansion coefficient of the semi-conductor substrate, .alpha..sub.2 is the linear thermal coefficient of the solder, and .DELTA.T is the difference between the die-bonding temperature at which the semi-conductor substrate is soldered to the conductive pad and room temperature.
REFERENCES:
patent: 4268849 (1981-05-01), Gray et al.
Gouldan et al, "Method For Producing Via-Connections in Semiconductor Wafers Using a Combination of Plasma and Chemical Etching", IEEE Transactions on Electrom Devices, vol. ED-30, No. 10, Oct. 1983, pp. 1402-1403.
Pavio et al, "GaAs MMIC Evaluation Of Via Fracturing", IEEE GaAs IC Symposium, 1988, pp. 305-307.
Ozaki, "Method For Preventing Via-Hole Crack", Transactions of Engineering, 1991.
Crane Sara W.
Guay John
Mitsubishi Denki & Kabushiki Kaisha
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