Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1997-12-01
2000-05-16
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257778, H01L 2304
Patent
active
060641142
ABSTRACT:
A semiconductor device (1) has a sub-chip-scale package structure, wherein the substrate (50) has at least one of an X dimension and a Y dimension smaller than a corresponding dimension of the semiconductor die (10). The semiconductor device (1) has a plurality of electrical connections between the semiconductor die and the substrate, the electrical connections (15, 20) being provided within the outer periphery of the substrate. The semiconductor device (1) permits packaging of semiconductor die (10) at the wafer level, that is, before the semiconductor die are singulated.
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Clark Sheila V.
Motorola Inc.
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