Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1995-06-05
1998-03-10
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257737, 257779, 257772, H01L 2348, H01L 2352, H01L 2940
Patent
active
057265011
ABSTRACT:
A semiconductor device according to the present invention to be mounted on a mounting substrate includes: a connection electrode formed on a surface of the semiconductor device; a solder bump formed on the connection electrode, the solder bump electrically and mechanically connecting the connection electrode with a substrate electrode formed on the mounting substrate; and a solder drawing layer provided on the surface of the semiconductor device in a periphery of the solder bump and having a surface portion composed of a solder-agreeable metal, the solder drawing layer retracting melted solder of the solder bump onto a surface of the solder drawing layer by contact with the melted solder.
REFERENCES:
patent: 3697828 (1972-10-01), Oakes
patent: 4710798 (1987-12-01), Marcantonio
patent: 5046161 (1991-09-01), Takada
patent: 5075965 (1991-12-01), Carey et al.
Rajac, "Integrated Circuit Structure Including Solder & Lead Frame", IBM TDM vol. 16 No. 6 Nov. 1973, pp. 1738-1739.
Arroyo T. M.
Saadat Mahshid D.
Sharp Kabushiki Kaisha
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