Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1996-05-21
1998-09-08
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257780, 257728, 257777, 257690, 257737, 257738, H01L 1312, H01L 2348
Patent
active
058048820
ABSTRACT:
A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as surrounding projecting electrodes and at least one shape selected from circles and polygons when viewed from the top, within an area surrounded by the connected electrodes, has a high flexural strength and high reliability and can be used for information cards, and the like.
REFERENCES:
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3893156 (1975-07-01), Riseman
patent: 4908689 (1990-03-01), McBride et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5220200 (1993-06-01), Blanton
patent: 5283446 (1994-02-01), Tanisawa
patent: 5329423 (1994-07-01), Scholz
patent: 5352318 (1994-10-01), Takabayashi et al.
patent: 5394490 (1995-02-01), Kato et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5508561 (1996-04-01), Tago et al.
patent: 5559316 (1996-09-01), Tomada
patent: 5578874 (1996-11-01), Kurogi et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5612573 (1997-03-01), Lewis et al.
patent: 5616958 (1997-04-01), Laine et al.
patent: 5629566 (1997-05-01), Doi et al.
patent: 5633535 (1997-05-01), Chao et al.
Patent Abstracts of Japan, vol. 17, No. 432 (E-1411) 10 Aug. 1993 & JP-A-05 090340 (Matsushita) 9 Apr. 1993--Abstract.
Patent Abstracts of Japan, vol. 18, No. 199 (E-1534), 7 Apr. 1994 & JP-A-06 005735 (Sony) 14 Jan. 1994--Absract.
Dokochi Hisashi
Hirosawa Yukihisa
Matsuoka Hiroshi
Mikami Yoshikatsu
Tsukagoshi Isao
Hitachi Chemical Company Ltd.
Thomas Tom
Williams Alexander Oscar
LandOfFree
Semiconductor device having a semiconductor chip electrically co does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having a semiconductor chip electrically co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a semiconductor chip electrically co will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1284374