Semiconductor device having a semiconductor chip and resin...

Details Semiconductor device having a semiconductor chip and resin... Semiconductor device having a semiconductor chip and resin...

2008-11-07

2010-12-21

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S773000, C257S787000, C257SE21499, C257SE23011

Reexamination Certificate

active

07855464

ABSTRACT:
A semiconductor chip has a main surface. A conductive portion is provided on the main surface and made from a material having conductivity and malleability. A sealing resin portion has a surface facing the main surface. An electrode is provided on the conductive portion and passes through the sealing resin portion between the conductive portion and the surface. As a result, there is provided a semiconductor device that can be downsized.

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Office Action issued Aug. 13, 2010, in German Application No. DE 10 2009 011 233.2-33, filed Mar. 2, 2009 (with English language translation) 10 pages.

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