Semiconductor device having a semiconductor chip and resin...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

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Details

C257S773000, C257S787000, C257SE21499, C257SE23011

Reexamination Certificate

active

07855464

ABSTRACT:
A semiconductor chip has a main surface. A conductive portion is provided on the main surface and made from a material having conductivity and malleability. A sealing resin portion has a surface facing the main surface. An electrode is provided on the conductive portion and passes through the sealing resin portion between the conductive portion and the surface. As a result, there is provided a semiconductor device that can be downsized.

REFERENCES:
patent: 2002/0043708 (2002-04-01), Muto et al.
patent: 2004/0070066 (2004-04-01), Ogawa
patent: 2006/0261493 (2006-11-01), Boon
patent: 2007/0257351 (2007-11-01), Lee et al.
patent: 2009/0051031 (2009-02-01), Lai et al.
patent: 62-142338 (1987-06-01), None
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patent: 1-281759 (1989-11-01), None
patent: 10-116962 (1998-05-01), None
patent: 11-168168 (1999-06-01), None
patent: 11-214600 (1999-08-01), None
patent: 2003-7966 (2003-01-01), None
patent: 2003-133508 (2003-05-01), None
patent: 2006-319084 (2006-11-01), None
Office Action issued Aug. 13, 2010, in German Application No. DE 10 2009 011 233.2-33, filed Mar. 2, 2009 (with English language translation) 10 pages.

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