Semiconductor device having a plurality of semiconductor chips

Details Semiconductor device having a plurality of semiconductor chips Semiconductor device having a plurality of semiconductor chips

1993-09-24

1995-12-26

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257667, 257725, 257787, H01L 2316, H01L 2328

Patent

active

054790514

ABSTRACT:
A semiconductor device includes at least a first semiconductor chip and a second semiconductor chip each having a first surface and a second surface. The second surface of the first semiconductor chip confronts the first surface of the second semiconductor chip. Additionally, the semiconductor device includes a plurality of leads having inner portions and outer portions, where the inner portions of the leads are electrically coupled to selected portions on one of the first and second surfaces of each of the first and second semiconductor chips. An insulator is interposed between the second surface of the first semiconductor chip and the first surface of the second semiconductor chip at portions other than the selected portions. Further, a resin package encapsulates the first and second semiconductor chips so that the outer portions of the leads project outside the resin package.

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