Semiconductor device having a plurality of laminated...

Details Semiconductor device having a plurality of laminated... Semiconductor device having a plurality of laminated...

2006-01-03

2006-01-03

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S783000, C257S686000

Reexamination Certificate

active

06982489

ABSTRACT:
A semiconductor device has a plurality of laminated semiconductor elements2,and highly water-absorbing resin films3formed between the semiconductor elements. Here, the highly water-absorbing resin films3preferably contain water or a low-boiling-point organic solvent. Alternatively, the highly water-absorbing resin films may contain, or may be allowed to contain after packaging, an organic solvent having a boiling point equal to or higher than the reflow temperature of solder.

REFERENCES:
patent: 4696764 (1987-09-01), Yamazaki
patent: 6278181 (2001-08-01), Maley
patent: 2003/0155664 (2003-08-01), Sumita et al.
patent: 2004/0012098 (2004-01-01), Yamazaki et al.
patent: 61-288455 (1986-12-01), None
patent: 5-136207 (1993-06-01), None

Affiliated with

Also associated with

Rating

Semiconductor device having a plurality of laminated... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a plurality of laminated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a plurality of laminated... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3556918